An outlook on emerging 3D MEMS fabrication using thermoplastic polymer reflow for actuation will illuminate the way towards smart, i.e, stimuli responsive 3D structures. If you go beyond 230-240C youll start to incinerate your PCBs, which although amusing, is probably not what you want. The parameters of certain components will also directly impact the temperature curve selected for this step in the process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. In my case, the solder balls would start to melt at 183C and I wanted to hit a top temperature of 210C. Reflow soldering is an extremely vital step in the SMT (Surface Mount Technology) process. Furthermore, we provide new results and new insights into dynamic material changes during thermoplastic reflow. Youll have to check the reflow profile for your particular components to know what temperature youre trying to reach. In-depth examples cover optical and biomimetic applications. To enhance the understanding of current reflow methods, we review the history of polymer reflow and discuss its simulation. All the covered methods have in common that they exploit a specific material contrast that enables a post-processing and thus a transformation of the initial pattern by polymer reflow into a new surface topography or shape. By this, new functionalities such as aspheric, freeform and ultra-smooth surfaces can be provided. The innovative structures in this work become only possible by combining the initial patterns with methods to reshape them. We start the discussion with the principal capabilities of grayscale electron beam lithography and multi-photon lithography for initial patterning. This is a topical review on advanced lithographic methods used to create 3D topographies.
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